Technology


LASER Technology Equipment
Line-up




LASER Technology
1. LASER MARKING SYSTEM
(General Information)

Process

Backplane 및 Cell 공정 전



  • Feature

    ㆍ Multi-Marking system
    ㆍ Minimal Foot print
    ㆍ Inspection System
    ㆍ OTF Motion System

  • Specification

    ㆍ Laser : UV
    ㆍ Power : 20W
    ㆍ Wavelength : 355㎚
    ㆍ Method : Multi-Head
    ㆍ Dimension : 3200x3200x2700㎜
    ㆍ TACT : TBD
    ㆍ S/W : PC PCI, RTC, UMAC Interface
    ㆍ CIM Support : Available


  • Application

    ㆍ Marking, Patterning
    ㆍ Glass, Paper, metal, ITO


  • Overview

    ㆍ Display panel ID Marking
    ㆍ ITO patterning system


LASER Technology
2. LASER CHAMFERING SYSTEM
(General Information)

Process

Flexible Cell









  • Feature

    ㆍ Laser Full Cutting
    ㆍ Non-contact Type
    ㆍ High-throughput system

  • Specification

    ㆍ Laser : UV | CO2
    ㆍ Power : 20W | ~300 W
    ㆍ Wavelength : 355㎚ | 9.3~10.6 ㎛
    ㆍ Method : 4~12”
    ㆍ Dimension : 4500x4200x3200㎜
    ㆍ TACT : TBD
    ㆍ S/W : PC PCI, RTC, UMAC Interface
    ㆍ CIM Support : Available


  • Application

    ㆍ Laser Cutting & Full Breaking
    ㆍ Glass, Film, Polymer


  • Overview

    ㆍ Cell Corner Cutting
    ㆍ Glass & Film


LASER Technology
3. Sample result image by laser cutting process
(Corner Cut)


Before laser cutting process
(Top View)

 

After breaking process
(Top View)



LASER Technology
4. Pol-Film Edge Cutting System
(General Information)

Process

Rigid Module









  • Feature

    ㆍ Laser Full Cutting
    ㆍ Fume Suction & Blowing
    ㆍ High-throughput system
    ㆍ Debris free Quality

  • Specification

    ㆍ Laser : CO2
    ㆍ Power : 300 W
    ㆍ Wavelength : 10.6 ㎛
    ㆍ Method : 15~60”
    ㆍ Dimension : 5800x12400x6100㎜
    ㆍ TACT : TBD
    ㆍ S/W : PC PCI, UMAC Interface
    ㆍ CIM Support : Available


  • Application

    ㆍ Laser Full Cutting
    ㆍ LCD Pol, #D FPR film, Polymer


  • Overview

    ㆍ Display Pol Film Cutting : Monitor, TV
    ㆍ On Glass Film Trim Cutting


LASER Technology
5. Sample result image by Laser Cutting process :
(Film On Glass Cutting)



[ Film Layer ]

[ Side View ]

[ Top View ]


◈ Both Side cutting : CO2 Thermal Cutting + Ablation




[ Film Layer ]

[ Side View ]

[ Top View ]


LASER Technology
6. TSP LASER CUTTING SYSTEM
(General Information)

Process

TSP Patterning & Cutting









  • Feature

    ㆍ Multiple Laser System
    ㆍ High Resolution Inspection
    ㆍ OTF Motion System

  • Specification

    ㆍ Laser : UV | CO2
    ㆍ Power : 10W | ~300 W
    ㆍ Wavelength : 355㎚ | 9.3~10.6 ㎛
    ㆍ Method : Multi-Head
    ㆍ Dimension : 3500x3300x2800 ㎜
    ㆍ TACT : TBD
    ㆍ S/W : PC PCI, RTC, UMAC Interface
    ㆍ CIM Support : Available


  • Application

    ㆍ LCD, OLED
    ㆍ TSP, etc


  • Overview

    ㆍ TSP Process
    ㆍ ITO Patterning & Laser Cutting


LASER Technology
6. Sample result image by Laser cutting process




◈ panel Cutting



[ Mother Glass ]

[ Cutting image ]

[ Sample Image 1 ]



◈ cutting method : CO2 Thermal Cutting + Ablation




[ Sample Image 2 ]


LASER Technology
7. Array Laser Cutting System
(General Information)

Process

Flexible Deposition









  • Feature

    ㆍ High-Throughput
    ㆍ Chipping Free Quality
    ㆍ Real-time Laser Power feedback

  • Specification

    ㆍ Laser : CO2
    ㆍ Power : 500 W
    ㆍ Wavelength : 10.6 ㎛
    ㆍ Substrate Size : 5G ~ 6G
    ㆍ Dimension : TBD
    ㆍ TACT : TBD
    ㆍ S/W : PC PCI, UMAC Interface
    ㆍ CIM Support : Available


  • Application

    ㆍ CO2 Laser Cutting
    ㆍ LCD, OLED, etc


  • Overview

    ㆍ Flexible Line – Mother Glass Cutting


LASER Technology
8. Sample result image by laser cutting process (1)




◈ Glass Cutting


ㆍ Bare glass
ㆍ 절단 품질 유지 가능
ㆍ Glass Cutting line 정밀도 : ≤± 40㎛




◈ Sample image







LASER Technology
8. Sample result image by laser cutting process (2)


◈ 0.4~1.1T Cutting Quality

◈ 0.3T Cutting Quality

 


[ 0.7T Top View ]

[ 0.3T Side View ]

[ 0.1T Top View ]

 


[ 0.7T Side View ]

[ 0.3T Side View ]

[ 0.1T Side View ]


LASER Technology
9. Sample result image by laser cutting process (Tempered Glass)



[ Tempered Cutting Sample ]


LASER Technology
10. Flexible Cell Laser Cutting
(General Information)

Process

Flexible Cell – Film Cutting









  • Feature

    ㆍ Multi-process System
    ㆍ high throughput & precision cutting
    ㆍ Fume Suction & Blowing

  • Specification

    ㆍ Laser : Pico UV | CO2
    ㆍ Power : 30 W | 300 W
    ㆍ Wavelength : 355 ㎚ | 9.3~10.6 ㎛
    ㆍ Straightness : < 40 ㎛
    ㆍ Substrate Size : max 925 x 1500 ㎜
    ㆍ Dimension : TBD
    ㆍ TACT : 2.5 sec/cell, 132cell (TBD)
    ㆍ S/W : PC PCI, RTC, UMAC Interface
    ㆍ CIM Support : Available


  • Application

    ㆍ OLED
    ㆍ PI, Polymer, etc


  • Overview

    ㆍ Flexible Line - Film Cutting
    ㆍ Cell Size Cutting


LASER Technology
11. Sample result image by laser cutting process



[ Film Layer ]


[ Top View ]


Coating Technology
– Slit Coating & Dry Baking -






Coating Technology
- Slit Coating & Dry Baking -


 
 




Coating Technology
– Dual Gantry Slit Coating -




LAMI & Bending Technology
– LAMI & Assembling(Bending) -